Nanobreadboards with nanomagnets for localized heating
A device and method for selective, localized heating of solder via magnetic nanowires for connecting nanodevices
Technology No. 2021-224
IP Status: US Patent Issued; Patent number 12,300,591
Preliminary results
Applications
- Nanoscale electronics
- Optoelectronics e.g. large-scale beam-forming
- Wireless communication- 5G/6G/7G
- Interconnects and microelectronic integration
- Memory chips
Technology Overview
Researchers at the University of Minnesota have developed an approach for scaling down micro-/nanoelectronic interconnects. This approach utilizes an alternating magnetic field applied to magnetic nanowires to reflow solder to connect electronic devices. Localized, selective heating is achieved, providing a path for further scaling device integration, particularly for nanodevices. This novel process is compatible with 3D chip arrays and stacked layers.
Phase of Development
TRL: 2-3Preliminary results
Desired Partnerships
This technology is now available for:- License
- Sponsored research
- Co-development
Please contact our office to share your business’ needs and learn more.
Researchers
- Bethanie Stadler, PhD Professor, Department of Electrical and Computer Engineering
- Rhonda Franklin, PhD Professor, Department of Electrical and Computer Engineering